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Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

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Content provided by Endeavor Business Media. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Endeavor Business Media or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ro.player.fm/legal.

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.

  continue reading

31 episoade

Artwork
iconDistribuie
 
Manage episode 441541260 series 3545804
Content provided by Endeavor Business Media. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Endeavor Business Media or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ro.player.fm/legal.

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.

  continue reading

31 episoade

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