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Episode 8: Water vapor plasma bonds gold electrodes for flexible electronics

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Content provided by MRS Bulletin. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by MRS Bulletin or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ro.player.fm/legal.

In this podcast episode, MRS Bulletin’s Sophia Chen interviews Kenjiro Fukuda from RIKEN in Japan and Masahito Takakuwa of Waseda University about a technique to connect integrated electronics while maintaining their flexibility. They demonstrated the method on two gold electrodes. To make the two pieces of gold bond, the researchers treated the gold with water vapor plasma. The researchers used this technique to electrically connect the gold electrodes of an organic photovoltaic to an organic light-emitting diode without adding significant thickness, thereby ensuring the flexibility of the device. This study is published in Science Advances (doi:10.1126/sciadv.abl6228).

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99 episoade

Artwork
iconDistribuie
 
Manage episode 327730364 series 2602554
Content provided by MRS Bulletin. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by MRS Bulletin or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ro.player.fm/legal.

In this podcast episode, MRS Bulletin’s Sophia Chen interviews Kenjiro Fukuda from RIKEN in Japan and Masahito Takakuwa of Waseda University about a technique to connect integrated electronics while maintaining their flexibility. They demonstrated the method on two gold electrodes. To make the two pieces of gold bond, the researchers treated the gold with water vapor plasma. The researchers used this technique to electrically connect the gold electrodes of an organic photovoltaic to an organic light-emitting diode without adding significant thickness, thereby ensuring the flexibility of the device. This study is published in Science Advances (doi:10.1126/sciadv.abl6228).

  continue reading

99 episoade

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